Advanced Packaging - INDUSTRY NEWS TODAY

Chase EMS Facility Joins Raytheon Supplier Program
WEST BRIDGEWATER, MASS.
Chase EMS Group's Sunburst facility is improving process efficiency, cutting costs, and improving quality by working in conjunction with Raytheon Corp.'s "Six Sigma with Suppliers" program.
The program is a knowledge-based business strategy to maximize customer value and grow business. The program helps Raytheon's key suppliers become better partners with the company.
"Teaching Raytheon Six Sigma to valued suppliers like Sunburst allows Raytheon to optimize the supply chain and deliver significantly more value to our customers," said Joel Taves, N&MIS strategic sourcing manager for Raytheon. (May 13)

Corbett Appointed President of Cookson Electronics Chemistry
WEST HAVEN, CONN.
Steven J. Corbett has been appointed president, Cookson Electronics Chemistry. His responsibilities include leading and growing the Enthone chemistry business worldwide.
Corbett began his career with Cookson Electronics in 1990 at Alpha Metals Inc. In 1996, he was named president of Polyflex Circuits Inc., a Cookson Electronics company. After the sale of Polyflex in 2000, he was promoted to general manager and senior vice president of Cookson Semiconductor Packaging Materials (CSPM). (May 10)

Encompass Buys Business Operations and Assets of TTI Silicon
VANCOUVER, WASH.
Encompass Materials Group Ltd. has purchased the business operations and assets of TTI Silicon. The new company specializes in reclaim services for 150 mm and 200 mm silicon wafers and brokerage services for silicon materials and other fab services for thin films and oxides.
Encompass will also expand their role to offer sales representation for additional products. They are currently in discussion with several new partners in this capacity. Lynn Brewer has joined as chairman of the board. Robert P. Swor has been named EMG's President and CEO. (May 9)

EMS Industry Records First Dip Since 1985
NORTHBROOK, ILL.
The IPC has released its 2001 Analysis of the North American Market for Electronics Manufacturing Services (EMS). The document, commissioned by the Technology Market Research Council (TMRC), details industry trends for the EMS industry in 2001 and was produced from data provided to IPC from 37 North American EMS providers with approximate 2001 net sales of $8.7 billion.
The document reports that because of the overall slow down of the North American economy and lagging sales in the communications market, the EMS industry, with an estimated $35.8 billion in sales in 2001, experienced a negative growth rate last year for the first time since 1985. Despite the $3.6 billion downturn from 2000 sales of $39.4 billion, the report positively projects the EMS industry's future, forecasting $60.1 billion in sales by the year 2005.
The report projects that the total available market for EMS companies (excluding system and box build activities) will total $115.5 billion and will consist of assembly services ($43.9 billion), semiconductors ($41.7 billion), passive components ($15.1 billion), design, test, prototype, rework and repair services ($7.5 billion) and printed circuit board consumption ($7.3 billion). The report also estimates that the EMS market will continue to expand, primarily through acquisitions, and will hold 30 percent of the total available North American Electronics Assembly market. (May 8)

SEMX Completes Sale of Shares of American Silicon Products
ARMONK, N.Y.
SEMX Corp. has completed the sale of shares in American Silicon Products BV (ASP BV) in Europe to North East Silicon Technologies (New Bedford, Mass.). The wholly owned subsidiary was the European operations of SEMX's Wafer Reclaim Services Group, which is being discontinued by the company.
SEMX said it sold the ASP BV operation to concentrate on core microelectronic packaging and materials business that principally produces thermal management materials, modules, and interconnect components. The sold operation reclaims silicon test wafers for chip makers. (May 7)

Silicon Wafer Foundry Named Jazz Semiconductor
NEWPORT BEACH, CALIF.
SpecialtySemi, a pure-play, independent high-performance mixed-signal and radio-frequency (RF) silicon wafer foundry founded in 2000, has been renamed "Jazz Semiconductor." The Carlyle Group, a private equity firm, is the majority shareholder of the new company. (May 6)
Click here for this and more news briefs.

Strong Growth in 2001 for Worldwide R&D Center
LEUVEN, BELGIUM
IMEC, an international center that encourages joint research and development, announced increased income of 22 percent in 2001, despite the weak economic situation and what was possibly the semiconductor industry's worst year in history.
In 2001, IMEC's self-generated income rose by 22 percent to 91.1 million euro. Today, IMEC generates 76 percent of its total budget (119.8 million euro), with the remaining costs funded by the Flemish government. The income from international contracts amounted to 40 million euro, an increase of 32 percent, accounting for 44 percent of IMEC's self-generated income.
Last year, IMEC built its technology portfolio with its own intellectual property rights as a basis for cooperation with industrial partners. Results in 2001 included 41 patents granted, 39 patents filed and more than 1,000 papers published in scientific publications and conference proceedings. (May 3)

STATS Reports Consecutive Revenue Growth
SINGAPORE AND MILPITAS, CALIF.
ST Assembly Test Services Ltd (STATS) has reported its results for the first quarter ended March 31. According to STATS President and CEO Harry Davoody, first-quarter revenues increased 16.2 percent from the prior quarter to $39.4 million.
"This is the second sequential revenue growth and confirmed our belief that our business is on the path of recovery. Taken in the context of a shorter work month in February and a seasonally weak first quarter, this was an encouraging performance," said Davoody.
The company reported that recovery was broad-based. Of the four market segments that STATS targets, most of them saw growth, including broadband access, wireless and high-end digital. The optical and networking segment continued to have a weak showing. (May 2)

Palomar Promotes Jeffrey King
VISTA, CALIF.
Palomar Technologies Inc. has promoted Jeffrey M. King to vice president of sales and product support. King joined Palomar Technologies in 1988 when it was part of Hughes Aircraft, and he has held several engineering, sales, and marketing management positions.
King has been instrumental in changing Palomar's sales department from a representative paradigm to a technical direct sales force. He opened an office in Singapore to directly support sales and service in Asia and manages Palomar's European sales and service division. Recently, he initiated and developed Palomar Financial Services to provide flexible, competitive financing for the acquisition of Palomar equipment. (May 1)

Profit-taking Drives Down U.S. and Global SEMIndexes
SAN JOSE, CALIF.
The U.S. SEMIndex, an equity index of 47 North American manufacturers of semiconductor equipment and materials, dropped 10.60 percent in April to 214.81, according to Semiconductor Equipment and Materials International (SEMI). SEMIndex differentiates the stock performance of global semiconductor equipment and materials public companies from the SOX index, a more semiconductor-specific equity index comprised of 12 U.S.-only chip manufacturers and four of the largest SEM sector U.S. public companies.
"Stocks moved up during the first week of April because of good earnings reports from the large cap companies, such as LAM Research, KLA-Tencor, Teradyne and Novellus," explained Bear Stearns Industry Analyst, Robert G. Maire. "Then they moved down the second two weeks as earnings were released for the small and mid-cap companies."
"The bigger companies reported a pick up in orders of 25 to 30 percent," he said. "While the small and mid-cap companies could only talk about product demonstrations and had no orders to show for their efforts. This is not unusual when coming out of a down turn. The smaller companies usually lag by one or two quarters behind the big companies in securing new orders. Investors felt the stocks were overbought and took profits later in month, contributing to the drop."
By comparison, the tech-laden NASDAQ Composite Index dropped 8.53 percent during the same period, while the Philadelphia Semiconductor Index (SOX) fell 11.68 percent for the month.
The Global SEMIndex, which closed down 7.73 percent for the month to 206.10 is a composite of 65 global SEMI members in the U.S., Japan and Europe.
The global SEMIndex is comprised of public semiconductor equipment, materials and related services companies with individual market capitalizations of $50 million (U.S. equivalent) or more. SEMIndex is updated every 1 to 2 minutes throughout the global trading day and maintained on SEMI's investor website, www.semindex.org. (April 30)

Semitool Announces Q2 Results
KALISPELL, MT.
Semitool, Inc. has reported financial results for its fiscal 2002 second quarter, which ended March 31, 2002. Net sales for the were $31.3 million, up 17.1 percent from $26.8 million for the first quarter of fiscal 2002 and down 63.9 percent from $86.7 million for the same quarter last year. The company reported a second quarter net loss of $4.1 million ($0.14 per share) compared to a net loss of $3.7 million ($0.13 per share) in the first quarter and net income of $30.2 million ($1.05 per diluted share) in the same quarter a year ago. Last year's second quarter net income includes a $19.5 million ($0.68 per diluted share) gain from the sale of the company's software control business.
Semitool also reported that sales for the first half of fiscal year 2002 were $58.1 million, down 61.8 percent from $152.0 million in the same period in fiscal 2001, resulting in a first half net loss of $7.8 million. Shipments for this period were $38.5 million, up sequentially from $17.4 million in the first quarter of this year.
Fiscal 2002 second quarter gross profit margin improved to 47.8 percent from 46.5 percent in this fiscal year's first quarter, primarily because of changes in the sales mix, according to the company. (April 29)

Unitive Forms New Sales Organization
RESEARCH TRIANGLE PARK, N.C.
Unitive Inc. has formed a new global sales and marketing organization with its Asian partner, Unitive Semiconductor Taiwan, which is based in Hsin-Chu Hsien and provides wafer bumping and redistribution services for six and eight inch silicon wafers. Under the arrangement, Unitive Taiwan's marketing and sales force will be incorporated into Unitive Inc.'s team to globally execute the companies' sales and marketing strategy. The two companies' application engineering, technology development and design functions will also be combined.
Robert Lanzone, vice president of sales and marketing, will be responsible for the combined sales and marketing forces for both facilities. In addition, Dan Mis, vice president of application engineering and design, will be responsible for the global engineering and design resources. (April 26)

Gryphics Names New Distributor
PLYMOUTH, MINN.
Gryphics Inc. has appointed inTEST KK (Tokyo) as the distributor for its GHz connectors in Japan. inTEST KK markets its own products in Japan, as well as final test manufactured by third parties, such as Finley Design load boards and Gryphics contacts.
Gryphics Inc. is engaged in the design, development, and manufacture of low cost standard and custom soldered and solderless, SMT socketing solutions for GHz device applications. The small footprint sockets are designed around JEDEC standards and support BGAs, LGAs, QFNs, SOs and QFPs. (April 25)

Georgia Tech to Offer Short Course Series in May
Georgia Tech's Packaging Research Center will offer a short course series entitled "Next Generation of Microelectronics and Microsystems Packaging Technologies" from May 16 to 24. The courses are designed for engineers and managers involved in R&D, design, manufacturing and process and product development for electronic components and systems in automotive, telecommunications, computers, medical and aerospace product sectors.
The course series will consist of individual modules taught by Georgia Tech faculty and industry experts. Attendees may register for any one of a number of modules, including such topics as SOP and SOC: The Best of Both for Next Generation of Systems; Fundamentals of Thermomechanical Reliability Microsystem Packaging; Polymers for Microelectronics; Optoelectronics: Devices, Circuits, Integration, and Test; and Integrated MEMS and Packaging.
For more information, please contact Dr. Leyla Conrad (leyla.conrad@ece.gatech.edu). (April 24)

Book-to-Bill Ratio Hits 16-Month High
SAN JOSE, CALIF.
North American-based manufacturers of semiconductor equipment posted $839 million in orders in March 2002 (three-month average basis) and a book-to-bill ratio of 1.04, according to a report published by Semiconductor Equipment and Materials International (SEMI) this week. A book-to-bill of 1.04 means that $104 worth of new orders were received for every $100 of product billed for the month.
The three-month average of worldwide bookings in March 2002 was $839 million. The bookings figure is 14 percent above the revised February 2002 level of $737 million and 30 percent below the $1.2 billion in orders posted in March 2001. The three-month average of worldwide billings in March 2002 was $808 million. The billings figure is one percent below the revised February 2002 level of $818 million and 60 percent below the March 2001 billings level of $2.02 billion.
"The three month average billing figure softened slightly from the prior month. However, the overall ratio of bookings to billings rose above unity for the first time in 16 months, signaling prospects for an improving industry revenue picture in the months ahead," said Stanley Myers, president and CEO of SEMI. "While we look for further confirmation of a recovery in the semiconductor equipment market, the improving trends are encouraging." (April 23)

StratEdge Ceramic Packages Used By Rockwell Scientific
SAN DIEGO, CALIF.
Rockwell Scientific Co. (RSC) has selected StratEdge to provide the packages and assembly services for its high performance dual track and hold chip for ultra-wideband data acquisition. Rockwell Scientific is a developer of high-speed mixed signal circuits for commercial and defense applications.
The Rockwell Scientific package is based on the patented StratEdge leaded LCC (low cost commercial) family of DC to 23 GHz amplifier packages. This ceramic microwave package features four RF leads and multiple DC leads for attachment to the next level of the system without sacrificing electrical performance. Cavities were customized to fit the RSC chip and other components, and the RF traces were optimized for speeds in excess of the current chip requirements. StratEdge designed and manufactured the package, as well as performed the polymer die attach, automated gold wedge wire bonding, lid sealing and marking services, and final lead trim. (April 22)

Adept Technology Signs Modular Automation
SAN JOSE, CALIF.
Adept Technology Inc has signed Modular Automation, an assembly automation company based in the U.K., as a photonics partner whereby the company will develop complete photonics manufacturing solutions based on Adept automation products, focusing on fiber preparation and handling applications.
The agreement is intended to give Adept customers customized turnkey solutions based on Adept's photonics automation tools.
"We are very excited that Modular Automation has signed on as our Preferred Photonics Partner," said Charlie Duncheon, vice president of business development for Adept Technology. " Modular's reputation for leading edge development, quality and reliability matched with Adept's technological developments make for the best, full custom solution available in the marketplace." (April 19)

2002 European SEMI Award Announced
MUNICH, GERMANY
Franz Sumnitsch, vice chairman of the board of directors of SEZ Holding Ltd and CEO of the SEZ Group, received the European SEMI Award for 2002 at an industry association reception held in Munich this week. The award honors his substantial contribution to the semiconductor industry.
Sumnitsch, who holds 12 patents related to the semiconductor industry, is recognized for developing a spin processing approach for semiconductor manufacturing. The new single wafer wet processing technology, introduced in 1989, became a major, globally accepted process technology for chipmakers worldwide.
"The semiconductor manufacturing industry has greatly benefited from the development of spin processing technology," said Walter Roessger, president of SEMI Europe. "Through his dedication, and innovation, Franz Sumnitsch has made a significant contribution to the advancement of the global microelectronics industry. SEMI members in Europe and around the world applaud Franz's important accomplishments with the European SEMI Award."
The SEZ spin processor was the first single wafer wet process equipment introduced for semiconductor manufacturing. (April 18)

International SEMATECH Launches 300 mm Standards Certification
AUSTIN, TEXAS
International SEMATECH (ISMT) has launched an industry effort to define a single set of requirements and objective tests for the certification of 300-mm equipment. The push for universal criteria for certifying equipment will enable independent testing that ensures the objectivity and industry acceptance of pre-delivery conformance test results.
The goal this year is to establish general guidelines that can be applied to any standards domain as well as focused criteria for 300-mm equipment software standards testing and accreditation.
"The ultimate goal of this effort is to save the semiconductor industry from redundant testing," said Scott Kramer, director of Manufacturing Methods and Productivity at ISMT. "By setting up industry guidelines and processes and certifying the companies that apply those criteria in testing equipment, we can save our member companies the time and expense of testing the same tools that their neighbor down the street just tested. Suppliers also benefit from the elimination of redundant testing."
Early this year International SEMATECH began assembling a team of industry volunteers from Europe, the U.S., Taiwan and Japan to establish the requirements and criteria for the accreditation and management of third party entities that will certify conformance to semiconductor equipment standards requirements.
Draft guidelines, scheduled for publication in July, will focus on processes and criteria for administering agencies and test service providers, as well as a standardized process for creating tests and test criteria from standards and customer requirements. Final guidelines are expected to be published in December. (April 17)

NEMI Names New Chair and Consortium Leaders
HERNDON, VA.
The National Electronics Manufacturing Initiative (NEMI) has announced that Nasser Grayeli, vice president of Intel Corp.'s technology and manufacturing group and director of assembly technology development, will serve as NEMI's new chairman. The group also named Srinivas Rao, vice president of technology for Solectron Corporation, and Leslie Guth, director, supply chain networks, for Lucent Technologies, as co-directors of planning.
The industry-led consortium has also appointed two new representatives to its technical committee and re-elected three directors. Bill Barthel (Plexus Corp.) and Sundar Kamath (Sanmina-SCI) have joined the NEMI technical committee. Marc Benowitz (Lucent Technologies), Iwona Turlik (Motorola Advanced Technology Center) and John Pomeroy (Dover Technologies International) were re-elected to three-year terms on the NEMI board of directors.
Grayeli becomes NEMI's fourth chairman since the consortium was organized in 1995. He has served on the NEMI board of directors since 1999 and replaces Pomeroy as chairman.
"We are pleased to welcome all of these individuals to the NEMI leadership," said Jim McElroy, executive director and CEO of NEMI. "NEMI has a small core staff, and the consortium's work is principally done by people from our member companies. The members of our board and technical committee play very active roles in our operations, so it is critical that we build a solid base of experience and strong leadership capabilities." (April 16)

European Market Share Improved in 2001
European chip equipment suppliers gained market share in 2001 against U.S. and Japanese suppliers, according to a recent report by VLSI Research. The total sales for European suppliers were $4.44B in 2001, a 27 percent decline from 2000. Their U.S. counterparts saw a 40 percent decline, while Japanese suppliers were down by 30 percent.
In an overall ranking of European companies, traditional semiconductor equipment suppliers ASML and ASM International led with sales of $1544M and $463M, respectively. Both of these companies had significant drops in sales in the first half of 2001 but recovered with solid stabilization in the later part of the year.
Unaxis, Aixtron, SUSS MicroTec and SEZ ranked in positions three to six.
"We are pleased to see the very high diversity of the European chip equipment supplier base," stated Bob Mariner, managing director, VLSI Research Europe. "The Top 10 list has companies in all semiconductor-related equipment markets and this diversity helped them gain market share in 2001."
The balance of the European Top 10 list consists of a variety of companies. ESEC and FICO are both assembly equipment suppliers and achieved positions seventh and tenth, respectively. Trikon, a deposition and etch systems supplier, was ranked eighth, while Multitest, a supplier of package handling equipment for ATE, was ninth. (April 15)

Add RSS Feed