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NEW PRODUCT HIGHLIGHTS

Adhesives
BEDFORD, MASS.
Tra-Bond 2151 from Tra-Con Inc. is a thermally conductive adhesive that can be used for different applications, including staking transistors, diodes, resistors, ICs and other circuit board applications. The electrically insulating compound is said to bond well to metals, silica, steatite, alumina, ceramics, glass and plastics. The room temperature curing system exhibits chemical resistance. (February 15)

Navigation Control Software
CARSON CITY, NEV.
The netProbe navigation control software from Micromanipulator has DDE, RS-232 and GPIB communication capabilities, making it easy to interface with other applications and parametric testers. The probe controlled software is available for Windows 95/98/NT as well as optical version for Sun Solaris, UNIX, LINUX or Macintosh operating systems. The software makes navigating probing sites, creates wafer maps, and stores location and measurement results. (February 15)

Dispensing System
LIVERMORE, CALIF.
The L1520 Series of dispensing systems from Allteq are designed to perform glob top, full and selective die coating, underfill, and dam and fill. The die coating series includes UV cure capabilities for same station curing, and micro-volume dispensing for critical volume controls. The systems also features indexing solutions for a wide range of lead frames, substrates and carrier boats. (February 14)

Simulation Software
PITTSBURGH, PA.
Ansoft HFSS software from Ansoft Signal Integrity is an interactive software package that computes s-parameters and full wave fields for arbitrarily shaped 3-D passive structures. The software features an intuitive interface, a field-solving engine with accuracy driven adaptive solutions, and a powerful post-processor. The software eliminates traditional prototyping, reducing development costs and speed time-to-market. (February 14)

Voltage Regulators
SANTA CLARA, CALIF.
The Si91842 and Si91844 from Vishay Intertechnology are two new 150 mA low-noise regulators that feature low dropout and ground current in a compact package. Both of the regulators are designed to maintain regulation while delivering 300 mA peak output current in applications with a high-surge currents at turn-on. The regulators reportedly hold a low ground current of 110µA at 150 mA, and hold a low dropout voltage of 130 mV. They are both also available in a range of 14 fixed output voltage options from 1.8 to 5.0 V. (February 13)

Programming System
REDMOND, WASH.
FlashPAK from Data I/O is a networked programming system designed to program high-density flash memory devices at near theoretical minimum times and at the lowest cost per part. The four-site manual system brings the benefits of network control and advanced programming architecture to manual flash programming environments, ensuring that programming is current, secure, traceable and failsafe. (February 13)

Heat Curable Adhesive
BRECKENRIDGE, COLO.
OPTOCAST AC-3716 from Electronic Materials Inc., is a low-viscosity, one-component acrylate based formulation. Exposing the adhesive to ultraviolet light in the 320-380 nm wavelength range is said to cure the adhesive almost instantly. Also, the adhesive is said to cure to a soft, compliant material with a Shore A hardness of 60. (February 12)

BGA Adapter
FRENCHTOWN, N.J.
A new BGA circuit bridge adapter from Aries Electronics is a cost-effective means of upgrading to higher performance devices as well as testing boards and devices without changing PCB layouts. This adapter internally bridges the BGA device's circuitry without any need for board redesign or rework and is said to have an operating temperature of 221°C. The adapter's board material is .062 inches thick FR-4 with 10 layers, and the solder balls are 0.20 inches in diameter. (February 12)

Rework Station
HUNTINGDON VALLEY, PA.
The M-8000 rework station from Manncorp, is able to remove and remount various components and produce assemblies that equal those produced in original assembly. The all-in-one system includes pad cleaning, dispensing and soldering/desoldering tools, as well as all the nozzles needed to work with any IC, PLCC or QFP. The system also features tools for BGAs and CSPs, a fast-on/fast-off IR underheater to prevent board warp, and SolderStar software that includes an expandable component library. (February 11)

Polysulfide Elastomer
HACKENSACK, N.J.
The EP21TPFL-1 is a two component, low-viscosity, highly flexible bonding, sealing and casting compound from Master Bond Inc. The compound is formulated at room temperature, is 100 percent reactive and does not emit any volatiles during curing. It also has a service operating temperature range of -65 to 300°F, and is designed to resist thermal and mechanical shock. (February 11)

X-ray and Test System
STAMFORD, CONN.
The upgraded .20 series from FeinFocus has been redesigned with improved X-ray tube and imaging chain technology. Imaging chain choices for the system now include the direct digital X-ray detector, providing enhanced digital image processing capabilities. These changes will increase the system's imaging capabilities and versatility while maintaining its most advantageous features such as the easy-to-use console and the versatile manipulator system. (February 8)

Flip Chip Series
TEMPE, ARIZ.
The U0402FCxxC Series from ProTek Devices is designed for small circuit board applications with limited size and space. They are available in single die (0402) configuration ranging from 3.3 to 36 V, and are also bi-directional, making them ideal for differential line protection on I/O ports. The flip chip series can be mounted directly on the PCB similar to chip resistors and capacitors, to help reduce installation costs and to act as a space saver. (February 8)

Angle Cutter
RALEIGH, N.C.
The Erem 2282E Angle Cutter from Erem, a CooperTools brand, is designed for SMT applications and through-hole component lead trimming. The head is angled to allow easy access to components on PCBs and can cut easily cut copper wire with a diameter as small as 0.1 mm and as large as 1.0 mm. The cutter is made of extruded 100 percent Eremadium tool steel and its patented internal Magic spring maintains constant fatigue-free operation for more than a million openings. (February 7)

Relay Switches
MASHPEE, MASS.
The MEDER CR-Series Reed Relay from MEDER Electronic Inc. is a low profile device made with a ceramic case that matches the thermal coefficient of expansion of the reed switch glass and the red lead. The 8.6 x 4.4 x 3.4 mm relay is capable of switching up to 6 GHz with more than 40 ps rinse time for digital operations and is also capable of withstanding reflow soldering operations up to 260°C. (February 7)

Fluid Dispensing System
HOPKINTON, MASS.
The Fishman LDS9000 mechanical dispensing system from Fishman Corp., is a fully programmable, electric powered system for precisely dispensing any viscosity fluid or adhesive. The air-free system features an easy to program control unit and a hand-held dispensing gun that employs a linear actuator-driven piston to push a fluid or adhesive through a plastic syringe. This dispenser runs on 115 VAC, while eliminating problems associated with conventional air dispensers, such as variations in pressure, moisture and fluid viscosity. (February 6)

Chip Resistors
MALVERN, PA.
The TNPW series of nichrome thin-film rectangular chip resistors from Vishay Intertechnology Inc. are said to be ideal for various applications requiring excellent stability, tight tolerances and low TCR. This resistor family includes low electrical noise, tolerances as low as 0.1 percent and TCR values ranging from 150 ppm/°C to as low as 15 ppm/°C. The series also provides stability under normal and harsh environmental conditions, and are impervious to moisture. (February 6)

Smart Camera
RENTON, WASH.
The Quadrus EZ, which combines a vision system with the ease of a laser bar code scanner, is the newest addition to Microscan's smart camera product line. The Quadrus EZ is said to be a solution for reading linear bar codes and 2D symbols, such as Data Matrix used on components and PCBs. This field of view locator allows the user to positively align the reader to the symbol in a matter of seconds without the use of video monitors or even a PC. (February 5)

Recovery Diodes
EL SEGUNDO, CALIF.
The new series of 320A and 400A standard-recovery, stud-mount rectifiers from International Rectifier, are used to convert raw AC mains electricity into DC power. The DO-9 package expands the line of rectifiers with rating from 50 V 3200 V, and 300A to 400A. (February 5)

Epoxy Encapsulant
BEDFORD, MASS.
Tra-Bond 933-1 from Tra-Con Inc., is a black, highly filled, electrical insulating epoxy designed for encapsulanting microelectronic chips. The epoxy is moisture resistant, which gives it good protection from mechanical and environmental hazards, and its low coefficient of thermal expansion minimizes stress effects on components and wiring during thermal shock tests. The one component chip encapsulant can be stored at room temperature and holds a working life of 2 months. (February 4)

Test Software
CARSON CITY, NV
A new program, pcEmulate version 3.1.3, from The Micromanipulator Co. allows semi-automatic probe stations to emulate the communication commands of the Electroglas 2001 and EG 4080 probe stations, and the Micromanipulator 8860 probe station. This version of the software is operational under Windows 95/98 and Windows 2000 and also supports communication via the GPIB or RS-232 bus interface. (February 4)

Conformal Coating
BILLERICA, MASS.
Eccocoat UV 7993 from Emerson & Cuming, is a one component, solventless UV light and moisture cure conformal coating. This urethane-based coating offers chemical and moisture resistance, mechanical toughness and a resilience that minimizes potential component stress. The coating is said to emerge tack-free within 5 to 7 seconds after UV exposure and can be applied anywhere from 1 to 40 mils thick. (February 1)

Heat Sinks
CONCORD, ONTARIO
The new UltraCool IV pin heat sinks from Cool Innovations Inc. are designed to cool surface mount devices dissipating high loads of heat. The copper heat sinks are said to provide substantial cooling powers because of an efficient pin fin structure and the use of highly conductive copper. The heat sinks range from a footprint of 0.25 x 0.25 inches to a footprint of 1.5 x 1.5 inches and from an overall height of 0.15 x 0.8 inches. (February 1)

Transfer and Handling System
SOUTH BURLINGTON, VA.
The CTS 100 by Corfin Automation is a system designed as a flexible platform for the integration of various process modules. Components can be loaded and unloaded to and from the matrix, JEDEC trays, Auer boats, tubes and tape. The system can be equipped with different handlers and process modules such as bowl feeders, indexing tables, component inverters/rotators, marking systems, tape-and-reel equipment and test equipment. (January 31)

Image Scanner
WINONA, MINN.
The IMAGETEAM 3800ESD from RTP Co., is a high performance scanner designed for use in cleanroom assembly of sensitive electronic components. The scanner meets stringent regulations, and features properties such as low residual voltage, low surface resistivity and low tribo-generating characteristics. (January 31)

Reflow Solder Paste
INDUSTRY, CALIF.
The Multicore 63S4 RP15 no clean solder paste from Loctite Corp. is formulated with an alloy that eliminates costly tombstone defects that may occur when reflowing boards with small components. By eliminating tombstone defects, the solder paste is said to increase production yield, reduce the costs of rework and improve overall product quality. The alloy reportedly blends SN63 and SN62, holding melting points of 183 and 179°C. (January 30)

Solder/Desolder Stations
RALEIGH, N.C.
The WRS3000V1 and WRS3000V2 from Weller, a CooperTools brand, are two digital, self-contained, triple channel, solder/desolder stations for rework and repair of mixed technology boards. Both units offer 300 W of power over three independently controlled channels, with a built-in pump, providing air and vacuum. A temperature set back with a built-in timer from five to 60 minutes also is said to be available and can be programmed in five-minute intervals. A high reading indicates buildup of solder in the desoldering tool while a low reading indicates the need to change the air filter. (January 30)

Industrial CO2 Laser
BLOOMFIELD, CONN.
The Diamond GEM Q-400 from Coherent-DEOS, is an industrial Q-switched CO2 laser that combines ultra-short, high-peak-power pulses with a rugged, sealed package. The laser is said to be ideal for drilling and micromachining applications, including PCB microvia drilling, flex circuit machining and plastics processing. The laser system reportedly produces an average power of 15 W at 50 kHz repetition rate and 9.25 µm wavelength. It also features 2.5 KW peak power with pulse widths controllable to less than 150 ns, peak pulse energies to over 400 microjoules and repetition rates to 150 kHz. (January 29)

Crystal Oscillator
FORT MYERS, FLA.
The 77.76 MHz VCXO (Voltage Controlled Crystal Oscillator) from Fox Electronics is a compact 7.5 x 5.0 x 2.0 mm package for SONET applications. The input current for the VCXOs reportedly is 50 mA at 77.76 MHz, and output symmetry is 40 to 60 percent at 50 percent VDD. Also part of the VCS series, is the VCSAT (5.0 V) and VCSAXT (3.3 V) devices, which are said to decrease the amount of board space utilized, enabling telecommunications and instrumentation equipment designers to use the VCXOs in a wider range of package designs. (January 29)

Bonding Adhesives
TORRINGTON, CONN.
A new line of lens assembly adhesives from Dymax Corp. are designed for precision bonding, mounting, laminating and fixturing applications. Special UV blocking grades are said to be available that display good adhesion to PVA, CR-39 and CAP, and also provide UV/visible protection to 410 nm. Low shrinkage and high flexibility characteristics reportedly minimize movement, eliminate birefringence common to more rigid types of formulations. (January 28)

Stencil Cleaning Fabric
OLD HICKORY, TENN.
DuPont Sontara cleanmaster stencil cleaning fabric from DuPont is said to be uniquely constructed with exceptional absorbency and low-linting characteristics that quickly removes paste, adhesives and other particulates that ca cause bridging or gasketing in fine-pitch assemblies. The fabric reportedly is highly resistant to tearing, wet or dry, helping machines run at peak performance longer, which can reduce downtime and operator intervention. (January 28)

EMI Shielding Gaskets
WOBURN, MASS.
Cho-Form 5541 gaskets from Chomerics provide EMI shielding and demonstrate good galvanic corrosion resistance when dispensed on bare metal electronics housings. The corrosion-resistant material is an electrically conductive silicone elastomer, containing nickel-plated graphite particles that reportedly are robotically dispensed onto casting. The gaskets also provide shielding effectiveness above 70dB from 200 MHz to 10 GHz and can be heat-cured in just 30 minutes. (January 25)

DC/DC Converters
CARLSBAD, CALIF.
The ALH80 and AEH80 from Astec Power are 2.3 x 2.4 inches, 80 A half brick DC/DC converters. Reportedly, the ALH80 is the open-faced version, and the AEH80 is the version with a heat sink adapter plate attached. Both models are said to boast operating efficiencies of 87 percent while delivering 80 A, and 88.5 percent at 60 A. They also both feature optimized transient responsiveness and good stability, while delivering power into high capacitance/low equivalent series resistance load. (January 25)

DIP Test Sockets
FRENCHTOWN, N.J.
The ultra-high temperature DIP test sockets from Aries Electronics are designed for 350°C and 500°C applications. The test sockets reportedly feature a high-temperature ceramic body and high-conductivity stainless steel contacts, and also are offered in both through-hole and surface mount versions. The sockets accept devices from 0.300" (7.62 mm) to 0.600" (15.24 mm) center row-row devices up to 28 positions with leads on 0.100" (2.54 mm) pitch. (January 24)

Conductive Adhesive
BEDFORD, MASS.
The LX10026 from Tra-Con Inc. is a silver filled electrically conductive adhesive that can be stored at room temperature. The one-part epoxy reportedly speeds up production time by eliminating the need for mixing while offering the convenience of room temperature storage. This heat-cured epoxy also is said to have a shore D hardness of 90. (January 24)

Crystalline Polymer Materials
ROGERS, CONN.
ZYVEX liquid crystalline polymer circuit materials from Rogers Corp. are designed for high-performance electronics where high frequency, chemical resistance and fine line high-density interconnect requirements are critical. The materials are single-clad laminates that were developed primarily for flexible circuit applications, and also provide a significant increase in design latitude when compared to other existing materials, such as polyimides. Additional features are said to include good dimensional stability, reduces stress, lays flat, reduces variations in electrical performance and allows thinner layers. (January 23)

Tool Conditioning Oven
MINNEAPOLIS, MINN.
The Tool Conditioning Oven from Despatch Industries is designed to keep semiconductor parts and tooling clean, dry, and ready for immediate installation. The oven can be configured to hold either 200 or 300 mm tools. Horizontal airflow reportedly keeps the temperatures uniform up to 95°C, and HEPA filters reduce contaminations and increase reduce yields. (January 23)

Curing Epoxies
TORRINGTON, CONN.
A new line of UV curing, environmentally resistant epoxies from Dymax Corp. offers bonding, sealing and protective coating in seconds. The epoxies are designed to cure in just a few seconds, providing strong bonds in 1 to 24 hours. They are said to have good adhesion to various surfaces including glass, metal and plastics, producing slick, smooth, dry surfaces. (January 22)

Air Ionizer
AUSTIN, TEXAS
The 3M 990 Overhead Air Ionizer from 3M Electronic Handling and Protection Division neutralizes the static charges on the surface of any object, without taking up valuable workbench space. The cost-effective device reportedly has shielded emitter points located behind each of the two 2-speed fans, eliminating field-induced charges and ensuring a homogeneous mixture of ionized air. The unit also features removable, washable foam filters on fan intakes that protect internal components from environmental contamination. (January 22)

Micro Valve
HAVERHILL, MASS.
The DL Micro Valve from DL Technology LLC reportedly is designed for precision dispensing of small volumes of material. The rotation of the auger is said to be controlled by a brushless motor with a programmable encoder for achieving specific dispense parameters. The encoder provides more than 57,000 counts per 360° revolution of the auger, providing the control required for micro volume dispensing. The valve also is said to be available in various cartridge styles to accommodate three different needle styles. (January 21)

Tracking SmartChip
QUEBEC, CANADA
The SmartClip RF tag from Cogiscan Inc. is used for the tracking and controlling of Moisture Sensitive Devices (MSDs) in individual JEDEC trays. The plastic molded clip reportedly attaches securely to the end of JEDEC trays and contains a programmable memory chip that stores all relevant component information, including sensitivity level and expiration time and date. The clip also is said to be able to withstand baking conditions up to 125°C, allowing tracking of components through the complete manufacturing process. (January 21)

Silicone-free Gaskets
BRECKENRIDGE, COLO.
EMCAST FIPG 1850 from Electronic Materials Inc. is a soft UV curable epoxy, designed as an adhesive/sealant and gasket material. The epoxy reportedly can be dispensed into parts to either be gasketed, sealed or damped, and also is curable by UV light in the 325 to 380 nm range. Various hardness and viscosity are said to be available to suit many different substrates and end-use conditions in microelectronics. (January 18)

RF Test System
LAWRENCE, MASS.
A low-cost RF frequency burn-in life test system from ThetaDelta Technologies, features a conductive heating technology specifically designed for testing lower powered devices and subsystems. The system is said to be ideal for the life test of RF frequency devices up to 20 Ghz that dissipate around 10 W each. The company uses a scaled-down version of the conductive thermal control technology that is used in their high-powered control systems, called BakPak, for the testing of this lower powered device. (January 18)

Die Bonder
The Model 410-XP die bonder from Semiconductor Equipment Corp., reportedly achieves finished bond precision of plus/minus 1 to 2 µm. The bonder is said to offer enhanced optics and mechanical movements with a more stable granite-based platform. Other reported features include 750X magnification capabilities, wide range of closed loop bond load controls and easy calibrations of the viewing system. (January 17)

BGA Sockets and Adapters
The 1.00 mm and 1.27 mm-pitch BGA sockets and adapters from Aries Electronics have an operating temperature of 125°C with a current rating of 1 amp. The BGA sockets are said to have 3-finger female contacts that provide wiping action. The BGA adapters are said to feature three polarizing locating pins, ensuring perfect alignment of the adapter with the socket. When mated together, the BGA socket and BGA adapter reportedly measure 3.17 mm in height. (January 17)

Laser Diode
HERTFORDSHIRE, U.K.
The DL-LS1034 from Photonic Products is a 635 nm wavelength band, 20 mW laser diode reportedly designed to offer an increased operating temperature of 50?C for industrial and outdoor use applications. The laser diode is said to hold an operating current of 70 mA, a threshold current of 40 mA, an operating voltage of 2.3 V, a monitor current of 0.2 mA and a 9 mm package. (January 16)

Cleaning Pads
ST. PAUL, MINN.
3M Controlled Environment Cleaning Pads feature an open cell foam structure with a patented 3M coating technology designed to provide aggressive cleaning action while protecting delicate anodized coatings. The pads are said to be significantly lower in all ion contaminants, improving yields and reducing the chance of defective wafers. The two types of packaging that are said to be available are 3M Controlled Environment Cleaning Pad CE2200 and 3M Controlled Environment Cleaning Pad LC2200. (January 16)




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