IC Packagers' China Investment Proposals Approved
(May 16, 2008) Taipei, TAIWAN — Taiwan's Ministry of Economic Affairs (MOEA) has approved proposals by IC packaging and testing companies PowerTech Technology Inc., and Advanced Semiconductor Engineering Inc. to expand their ...
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Names in the News
(May 15, 2008) — It's been a busy month for human resources departments across the industry supply chain as sales forces are beefed up, management promotions and changes occur, and award recipients are announced. Here's a round-up ...
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EoPlex to Manufacture Innovative Cell Phone Antennas
(May 15, 2008) Redwood City, CA — EoPlex Technologies disclosed $4M additional funding to build its first full-scale production plant for the manufacture of state-of-the-art cell phone antennas. The company had previously announced ...
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EV Group Expands Presence in Korea
(May 14, 2008) St. Florian, AUSTRIA — EV Group, equipment manufacturer for semiconductor, MEMS, and nanotechnology applications, announced the opening of a subsidiary, EV Group Korea Ltd., in Seoul, Korea to serve as a direct-to-customer ...
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Vietnam - Chipscale Advanced Packaging Services Receives Certification
(May 14, 2008) Hanoi, VIETNAM — Vietnam-Chipscale Advanced Packaging Services, an outsource semiconductor assembly and test services provider based in Vietnam, has been presented with its investment certificate from th Vietnamese ...
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STATS ChipPAC Completes Qualification of Fan-in PoP
(May 13, 2008) SINGAPORE — STATS ChipPAC Ltd. announced the completion of full internal qualification of its Fan-in Package-on-Package (FiPoP) technology. Fully functional electrical samples are available, and production volumes ...
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Premier Semiconductor Opens Facility in Florida
(May 13, 2008) Tempe AZ — Premier Semiconductor Services, LLC announced the opening of a facility in St. Petersburg, Fl to provide quick-turn services for strategic east-coast accounts and to solidify Premier's growing counterfeit ...
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Avago Technologies Introduces RF Packaging Chip-scale Technology
(May 12, 2008) San Jose, CA — Avago Technologies, supplier of analog interface components for communications, industrial, and consumer applications; announced what it believes to be a breakthrough in packaging technology that ...
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Renesas Adopts Cadence Tool for Large Scale SoC and Flip Chip Design
(May 12, 2008) San Jose, CA — Cadence Design Systems, Inc. announced that Renesas Technology Corp. has successfully taped out its most advanced and large-scale system-on-chip (SoC) design to date using the Cadence SoC Encounter ...
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Mentor Graphics Addresses IC Implementation Challenges
(May 9, 2008) Wilsonville OR — Mentor Graphics Corp. has aligned its integrated circuit (IC) implementation product lines under the design-to-silicon division to better address the design and manufacturing challenges of 45nm ...
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Endicott Interconnect Awarded Defense Contract Modification
(May 9, 2008) Endicott, NY — The U.S. Department of Defense has awarded Endicott Interconnect Technologies, Inc.(EI) a $148.6M contract modification for the continuation of the current program to produce card frame assemblies ...
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SMTA's 3D/SiP Symposium Promotes Industry-wide Collaboration
Last week's 3D/SiP Symposium hosted by SMTA, and co-sponsored by Advanced Packaging magazine, turned out to be an intimate gathering of approximately 55 attendees representing not only the U.S., but Canada, France, Japan, Taiwan, ...
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IEEE International Interconnect Technology Conference Goes 3D
(May 7, 2008) Burlingame, CA — When the IEEE International Interconnect Technology Conference convenes at the Hyatt Regency San Francisco Airport Hotel, Burlingame, CA, June 1-4, the focus will be squarely on 3D technologies. ...
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Flip Chip Goes 3D
By Daniel F. Baldwin, Ph.D. and Paul Houston, ENGENT, Inc.
With advances in wafer-thinning technology, 3D packaging now provides a robust platform for achieving high levels of integration, small package footprints, and thin ...
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Thoughts on the News
The Return of Vertical Integration
By Jeffrey C. Demmin, contributing editor
Many industries seem to oscillate between focusing on core competencies, and trying to grow businesses by expanding into new areas. Some ...
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Oerlikon Esec Introduces Product Family at SEMICON Singapore
(May 5, 2008) Cham, Switzerland and Singapore — Oerlikon Esec, provider of automated chip assembly equipment and system solutions for the semiconductor industry, formally introduced the introductory platform of an entirely new ...
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From The Editor
Meetings of the Minds
We learn a lot by observing others and listening to their ideas. It's easy to become myopic when we work alone. When we're required to look beyond the boundaries of our scope of knowledge to consider what ...
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IPC, Jisso Sponsor Advanced Interconnect Seminar
(May 1, 2008) Bannockburn, IL. — IPC — and the Jisso International Council (JIC) are sponsoring a technical seminar, "Implementing Advanced Interconnect Technology Solutions," May 21–22, 2008, in Atlanta. Hosted by Georgia ...
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TI CEO Inspires Engineering Students
(May 1, 2008) Urbana, IL — During a distinguished lecture, held Wednesday, April 30, 2008 at the University of Illinois to commemorate the 50th anniversary of the IC, Rich Templeton, chairman, CEO and president of Texas Instruments ...
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University of Michigan Team Receives Grant to Research Electronics Heat Management
(April 30, 2008) Ann Arbor MI — A team led by a University of Michigan mechanical engineer has received a five-year, $6.8-million grant from the Air Force to examine heat management issues in the spectrum of electronic devices ...
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Collaboration is the Theme at the 2008 Global STC Conference
(April 30, 2008) Niwot, CO — "Collaborative Solutions Beyond 2010" is theme of this year's Global STC Conference, organized by the Semiconductor Test Consortium, Inc. (STC). This interactive global forum, open to both STC member ...
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SUSS MicroTec To Develop Nano Imprint Technology with Philips Research
(April 29, 2008) Munich, GERMANY — SUSS Microtec and Philips Research, Eindhoven, Netherlands, announced a license agreement to develop an enabling technology called substrate conformal imprint lithography (SCIL). The intention ...
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