Technologists Investigate Challenges for 3D Interconnect Metrology
July 1, 2009 -- To gain a better understanding of how new and existing wafer metrology technologies can be used, modified, or enhanced to measure and improve 3D interconnect processes, SEMATECH will host a workshop dedicated to ...
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IC Assembly Houses in Taiwan See Robust Business
(June 22, 2009) TAIPEI, Taiwan — Taiwan's IC assembly firms are seeing revenues rise quarterly, with Advanced Semiconductor Engineering Inc. (ASE) and Siliconware Precision Industry Co. Ltd. expected to see respective revenues ...
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SEMICON West Exhibitor's Products
(June 23, 2009) — Following are some of the booth highlights from companies exhibiting at SEMICON West, July 14–16, 2009 in San Francisco, CA. Booth demonstrations include cleaning products for flip chips, bonded wafer ...
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EI Acquires eV PRODUCTS
(June 12, 2009) ENDICOTT, NY — Endicott Interconnect Technologies Inc. (EI) today announced it has acquired the assets of eV PRODUCTS, Inc., a business of II-VI Incorporated (Nasdaq Global Select: IIVI) and headquartered in ...
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Munich Electronics Summit Program
(June 12, 2009) MUNICH, Germany — The Munich Electronics Summit, debuting this year at productronica in November, consists of a private meeting for international corporate CEOs and a public forum with a keynote address and CEO Roundtable.
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Conference on 3D Architectures for Semiconductor Integration and Packaging
(June 2, 2009) RESEARCH TRIANGLE PARK, NC — The 2009 3D Architectures for Semiconductor Integration and Packaging Conference and Exhibition will bring together industry leaders to examine the practical and competitive landscape ...
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Extreme Electronics: A Show-Within-A-Show at SEMICON West
Something is emerging at SEMICON West this year, July 14-16, 2009, at San Francisco's Moscone Center. It's Extreme Electronics, focusing on MEMS, high brightness LEDs and solid state lighting, nanotechnology, and printed and flexible electronics.
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ECTC 2009 In Review
In a time when R&D is at the forefront of the industry, events like ECTC 2009 become critical for showcasing research achievements, as well as providing venues for learning about the latest developments across the spectrum of device manufacturing. ...
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Professor Rao Tummala to Present Keynote at 2009 International Wafer-Level Packaging Conference (IWLPC)
(May 29, 2009) MINNEAPOLIS, MN — Professor Rao Tummala, Advanced Packaging Editorial Advisory Board Member, will keynote the 6th Annual International Wafer-Level Packaging Conference (IWLPC), October 27–30, ...
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The Riley Report
Flip Chips and Flashlights
by George A. Riley, Contributing Editor
With the industry's attention riveted on the next-generation of TSV- enhanced stacked - everything 3D marvels, we sometimes forget how microelectronics ...
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Participate in APEX 2010: PoP Papers Encouraged
(May 19, 2009) BANNOCKBURN, IL — IPC — Association Connecting Electronics Industries invites researchers, academics, technical experts, and industry leaders to submit abstracts for the 2010 IPC APEX EXPO at Mandalay Bay ...
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Chip backend consolidation looms after decline in 2008
Semiconductor packaging/assembly/test companies are gently ratcheting up their manufacturing capacity, but it won't be enough to prevent a culling of the herd, with nearly 20 (mostly older) facilities likely to be shuttered within a span ...
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Angled Top-down Grind Method for Improved Via Filling Analysis
By Johannes Chiu, Ph.D., NEXX Systems, Inc.
Via filling analysis methods are mostly based on obtaining vertical cross-section images of the via. While these pictures provide a clear and easy way of visualizing the filling profile, ...
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Harman Receives IEEE Award for Wire Bonding Improvements
(May 13, 2009) PISCATAWAY, NJ — George G. Harman, a researcher at NIST, contributed enormously to wire bonding technology and helped transform a labor-intensive, manual procedure into the present automated, reliable process ...
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Yole Report: Memory Packaging & Integration Trends
(May 8, 2009) LYON, France — The memory semiconductor industry is about to go through major technological changes as new integration trends and disruptive packaging technologies pave the way to the future growth, reports Yole. ...
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TI introduces ultra-thin ESD/EMI embeddable package
By Françoise von Trapp, contributing editor
( May 7, 2009) Dallas, TX — Small enough to fit through the eye of a needle, Texas Instruments' latest contribution to IC packaging technology, the PicoStar, is expected ...
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Thoughts on the News
More Than a Hint of Good News
By Jeffrey C. Demmin, contributing editor
Venture capital funding for Si2 and Imbera; factories ramping at TI; and even some modernization at ECTC and IITC — recent packaging-related ...
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Micronic Laser Systems Moves to Acquire MYDATA
(April 21, 2009) TÄBY, Sweden — Micronic Laser Systems AB intends to acquire MYDATA automation AB. In the proposed transaction, Micronic would acquire MYDATA from Skanditek Industriförvaltning and the minority shareholders ...
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Simplicity Leads to 3D Packaging Success
By Francoise von Trapp, contributing editor
3D embedded technologies just got closer to volume manufacturing. We've been hearing variations on the embedding theme for quite some time, but as of yet, none have made it to high ...
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The Riley Report
Non-traditional Applications of Jet Dispensing
by George A. Riley, Contributing Editor
While jetting is common in semiconductor packaging, it is finding new applications in emerging fields. At the recent SMTA Pan ...
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3D IC Technology: Interconnect for the 21st Century
By Paul Enquist and Chris Sanders, Ziptronix, Inc.
In 3D IC technology, thinned, planar circuits are stacked and interconnected using through silicon vias (TSVs). 3D ICs have the potential to alleviate scaling limitations, ...
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Plasma Cleaning and Surface Modification for Microelectronics
By Gene Dunn, Panasonic Factory Solutions of America
Plasma technology offers a dry cleaning process that uses ionized gasses in vacuum chambers to remove contaminants for improved yields in gold bonding processes. Additionally, ...
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