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Gail Flower
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gailf@Pennwell.com
Main Phone Number:603-891-9395
Fax Number:603-891-9328

Francoise von Trapp
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Main Phone Number:603-891-9421
Fax Number:603-891-9328

Julia Goldstein
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Julia.Goldstein@sbcglobal.net

 
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Webcasts

Building Blocks and Roadmaps for 3D Integration
Original broadcast on
June 26, 2008




Advances in 3D Packaging: Focus on Lithography
Original broadcast on
April 30, 2008






Sockets that Meet Today's Needs
Original broadcast on
March 25, 2008

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Sponsored White Papers Library
Recently Added White Papers

We've Got Your Back: New Wafer Backside Coating™ Technology Offers Speed, Throughput and Cost-Effective Advantages over Alternative Materials & Methods (05/30/2008, Henkel Corporation)

Die Attach Film Technologies for Next-Generation Devices (03/04/2008, Henkel Corporation)

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Featured White Papers

We've Got Your Back: New Wafer Backside Coating™ Technology Offers Speed, Throughput and Cost-Effective Advantages over Alternative Materials & Methods (05/30/2008)
 

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