Advanced Packaging serves those in operations that integrate electronic component packages into circuitry of their end products. Advanced Packaging magazine debuted in 1992 to the IC packaging engineering community.
Each issue of Advanced Packaging highlights an important step in the IC packaging process, including wafer dicing, die placement, die attach, wire bonding, encapsulation/molding, lead forming, solder bumping, package inspection, package test, and laser marking, singulation, packing and shipping. Each step implements the latest trends and technologies, and is written by a leading IC packaging expert in the given field.
Advanced Packaging's editorial topics include CSP, flip chip, MCM, BGA, Microwave/RF, thermal management, wafer-level packaging, system-on-a-chip, s oldering, wire bonding, direct chip attach, die placement, substrates, KGD, thick/thin film, inspection and test, adhesives and epoxies/underfill, environmental packaging, COB and TAB. Regular magazine departments focus on step-by-step advanced packaging, partners in manufacturing, market trends, feature products and event coverage.
The online version of Advanced Packaging provides daily international business and industry-related news, current issue articles, and access to years of searchable editorial archives. Check the calendar of events for the next NEPCON, SEMICON, IMAPS or other industry-related conference, or refer to the Product Guide for vendor, product and service information.
Through this web site you can also access PennWell's Electronics Group which provides a broad spectrum of technical/specific information, news and products through on-line publishing, magazines, conferences and exhibitions, buyers guides, and newsletters. Other sites from the PennWell Network include:
Surface Mount Technology
Solid State Technology
CleanRooms
Portable Design
InfoStor
Integrated Communications Design
Control Systems
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