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2008 Advanced Packaging Awards |  | |
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SEMICON West Exhibitor's Products
(June 23, 2009) — Following are some of the booth highlights from companies exhibiting at SEMICON West, July 14–16, 2009 in San Francisco, CA. Booth demonstrations include cleaning products for flip chips, bonded wafer inspection systems, airborne particle sensor/monitors, die-attach systems, and more for semiconductor manufacturing, packaging, and test.
IC Assembly Houses in Taiwan See Robust Business
(June 22, 2009) TAIPEI, Taiwan — Taiwan's IC assembly firms are seeing revenues rise quarterly, with Advanced Semiconductor Engineering Inc. (ASE) and Siliconware Precision Industry Co. Ltd. expected to see respective revenues rise 50% this quarter and at least 20% next quarter, reports China Economic News Service (CENS) writer Ken Liu.
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EI Acquires eV PRODUCTS
(June 12, 2009) ENDICOTT, NY — Endicott Interconnect Technologies Inc. (EI) today announced it has acquired the assets of eV PRODUCTS, Inc., a business of II-VI Incorporated (Nasdaq Global Select: IIVI) and ...
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Munich Electronics Summit Program
(June 12, 2009) MUNICH, Germany — The Munich Electronics Summit, debuting this year at productronica in November, consists of a private meeting for international corporate CEOs and a public forum with a keynote ...
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ECTC 2009 In Review
In a time when R&D is at the forefront of the industry, events like ECTC 2009 become critical for showcasing research achievements, as well as providing venues for learning about the latest developments across the spectrum ...
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Extreme Electronics: A Show-Within-A-Show at SEMICON West
Something is emerging at SEMICON West this year, July 14-16, 2009, at San Francisco's Moscone Center. It's Extreme Electronics, focusing on MEMS, high brightness LEDs and solid state lighting, nanotechnology, and printed ...
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Conference on 3D Architectures for Semiconductor Integration and Packaging
(June 2, 2009) RESEARCH TRIANGLE PARK, NC — The 2009 3D Architectures for Semiconductor Integration and Packaging Conference and Exhibition will bring together industry leaders to examine the practical and ...
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Professor Rao Tummala to Present Keynote at 2009 International Wafer-Level Packaging Conference (IWLPC)
(May 29, 2009) MINNEAPOLIS, MN — Professor Rao Tummala, Advanced Packaging Editorial Advisory Board Member, will keynote the 6th Annual International Wafer-Level Packaging Conference (IWLPC), ...
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Angled Top-down Grind Method for Improved Via Filling Analysis
By Johannes Chiu, Ph.D., NEXX Systems, Inc.
Via filling analysis methods are mostly based on obtaining vertical cross-section images of the via. While these pictures provide a clear and easy way of visualizing ...
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The Riley Report
Flip Chips and Flashlights
by George A. Riley, Contributing Editor
With the industry's attention riveted on the next-generation of TSV- enhanced stacked - everything 3D marvels, we sometimes forget ...
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Should the back-end-of-the-line be re-named middle-of-the-line?
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